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SAP SE Bonds, 2.125% 13nov2019, EUR (FIGI BBG003M538J6, DE000A1R0U23, WKN A1R0U2)

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Domestic bonds, Senior Unsecured

Issue | Issuer
Issuer
  • M
    ***  | ***
    ***
  • S&P
    ***  | ***
    ***
  • F
    ***  | ***
    ***
Status
Matured
Amount
750,000,000 EUR
Placement
***
Redemption (put/call option)
*** (-)
ACI
Country of risk
Germany
Current coupon
-
Price
Yield / Duration
Calculate in two clicks! yield, duration and other parameters
Calculate in two clicks! yield, duration and other parameters
Calculator What is a calculator?
  • Placement amount
    750,000,000 EUR
  • Outstanding amount
    750,000,000 EUR
  • Face value
    1,000 EUR
  • ISIN
    DE000A1R0U23
  • Common Code
    085325329
  • CFI
    DTFUFB
  • FIGI
    BBG003M538J6
  • SEDOL
    B7XDRT2
  • Ticker
    SAPGR 2.125 11/13/19 EMTN

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Final Terms

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Bond is not traded; the issue is redeemed
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Issue information

Profile
Sap SE (f.n.a. SAP AG) is a Germany-based holding company of the SAP Group, which is engaged in enterprise applications solutions development. The Company's core business is selling licenses for software solutions and related services to ...
Sap SE (f.n.a. SAP AG) is a Germany-based holding company of the SAP Group, which is engaged in enterprise applications solutions development. The Company's core business is selling licenses for software solutions and related services to deliver a range of choices fitting the varying functional needs of its customers. Its solutions cover business applications and technologies, as well as specific industry applications. In-memory technology across its data management offerings enables customers to access the data, which they need, where they need it, when they need it. The Company is structured along Technology & Innovation Platform, Products & Solutions, Global Customer Operations, Chief Operations Office, Global Finance & Administration, and Human Resources.
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Volume
  • Placement amount
    750,000,000 EUR
  • Outstanding amount
    750,000,000 EUR
Face value
  • Face value
    1,000 EUR
  • Outstanding face value
    *** EUR
Listing
  • Listing

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Cash flow parameters

  • Reference rate
    ***
  • Coupon Rate
    ***
  • Day count convention
    ***
  • Interest Accrual Date
    ***
  • Coupon frequency
    *** time(s) per year
  • Payment currency
    ***
  • Maturity date
    ***

Cash flow

Export to Excel

Early redemption terms

***

Explore the most comprehensive database

1 000 000

bonds

80 234

stocks

167 970

ETF & Funds

70 000

indices

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— Are you looking for the complete & verified bond data?

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Why

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Placement

  • Placement method
    Open subscription
  • Placement
    ***
  • Initial issue price (yield)
    (***%)
  • Geographic breakdown
    ***
  • Investor breakdown
    ***
Participants
  • Depository
    ***

Conversion and exchange

  • Conversion terms
    ***

Latest issues

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Similar issues

News

29/05/2026 New issues: SAP SE issued international bonds (XS3393867810, XS3393869782, XS3393867224) in the amount of EUR 850, EUR 1000, EUR 800 mln maturing in 2029, 2033, 2028 respectively.
29/05/2026 New issue: SAP SE issued international bonds (XS3393869279) with the coupon rate of 3.25% in the amount of EUR 850 mln maturing in 2031
24/04/2026 SAP SE (NYSE:SAP) Q1 Earnings Preview: Cloud Growth, AI Strategy, and Valuation Insights
26/02/2026 SAP Releases Integrated Report 2025 and Files Annual Report 2025 on Form 20-F with the U.S. Securities and Exchange Commission
19/02/2026 SAP Proposes Dividend of €2.50 per Share
All organization news

IFRS/US GAAP reports

2024
IV q eng
2023
IV q eng
2022
IV q eng
2021
IV q eng
2020
IV q eng
2019
IV q eng
2018
IV q eng
2017
IV q eng
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Identifiers

  • ISIN
    DE000A1R0U23
  • Cbonds ID
    132255
  • CUSIP
    ***
  • CUSIP 144A
    ***
  • Common Code
    085325329
  • CFI
    DTFUFB
  • FIGI
    BBG003M538J6
  • WKN
    A1R0U2
  • SEDOL
    B7XDRT2
  • Ticker
    SAPGR 2.125 11/13/19 EMTN
  • Type of security by CBR
    ***
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Ratings

Bond classification

  • Senior Unsecured
  • Coupon bonds
  • Bearer
  • Non-complex financial instruments (MiFID)
  • Amortization
  • Callable
  • CDO
  • Convertible
  • Dual currency bonds
  • Variable rate
  • For qualified investors (CIS region)
  • Foreign bonds
  • Green bonds
  • Guaranteed
  • Inflation-linked principal
  • Supranational bond issues
  • Inflation-linked coupon
  • Mortgage bonds
  • Perpetual
  • Payment-in-kind
  • Non-Marketable Securities
  • Redemption Linked
  • Restructuring
  • Retail bonds
  • Covered
  • Securitization
  • Structured product
  • Commercial Bonds
  • Subordinated
  • Sukuk
  • Trace-eligible
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Restructuring

***

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