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TSMC Bonds, 1.5% 20may2027, TWD (FIGI BBG017DV0X61, B618D1, TW000B618D13)

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Domestic bonds, Green bonds, Senior Unsecured

Issue | Issuer
Issuer
  • M
    ***  | ***
    ***
  • S&P
    ***  | ***
    ***
  • F
    ***  | ***
    ***
Status
Outstanding
Amount
6,100,000,000 TWD
Placement
***
Redemption (put/call option)
*** (-)
ACI
Country of risk
Taiwan
Current coupon
***%
Price
Yield / Duration
  • Placement amount
    6,100,000,000 TWD
  • Outstanding amount
    6,100,000,000 TWD
  • USD equivalent
    190,351,369.91 USD
  • Face value
    10,000,000 TWD
  • ISIN
    TW000B618D13
  • CFI
    DBFUFR
  • FIGI
    BBG017DV0X61
  • Ticker
    TAISEM 1.5 05/20/27 11-3

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Issue information

Profile
Established in 1987, TSMC is the world's first dedicated semiconductor foundry. As the founder and a leader of the Dedicated IC Foundry segment, TSMC has built its reputation by offering advanced and "More-than-Moore" wafer production processes ...
Established in 1987, TSMC is the world's first dedicated semiconductor foundry. As the founder and a leader of the Dedicated IC Foundry segment, TSMC has built its reputation by offering advanced and "More-than-Moore" wafer production processes and unparalleled manufacturing efficiency. From its inception, TSMC has consistently offered the foundry segment's leading technologies and TSMC COMPATIBLE design services. TSMC has consistently experienced strong growth by building solid partnerships with its customers, large and small. IC suppliers from around the world trust TSMC with their manufacturing needs, thanks to its unique integration of cutting-edge process technologies, pioneering design services, manufacturing productivity and product quality.
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Volume
  • Placement amount
    6,100,000,000 TWD
  • Outstanding amount
    6,100,000,000 TWD
  • Outstanding face value amount
    6,100,000,000 TWD
  • USD equivalent
    190,351,370 USD
Face value
  • Face value
    10,000,000 TWD
  • Outstanding face value
    *** TWD
  • Increment
    *** TWD
Listing
  • Listing

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Cash flow parameters

  • Reference rate
    ***
  • Coupon Rate
    ***
  • Day count convention
    ***
  • Interest Accrual Date
    ***
  • Coupon frequency
    *** time(s) per year
  • Payment currency
    ***
  • Maturity date
    ***

Cash flow

Export to Excel

Early redemption terms

***

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1 000 000

bonds

100 000

stocks

175 910

ETF & Funds

100 000

indices

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— Are you looking for the complete & verified bond data?

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full data on over 1 000 000 bonds, 100 000 stocks, 100 000 indices, 17 000 ETF and 150 000 Mutual Funds; powerful bond screener; over 350 pricing sources among stock exchanges & OTC market; ratings & financial reports; user-friendly interface; available anywhere via Website, Excel Add-in and Mobile app.

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Why

You will have detailed descriptive & pricing data for 1M bonds, 100K stocks, 100K indices, 17K ETF and 150K Mutual Funds
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Placement

  • Placement method
    Open subscription
  • Placement type
    Public
  • Placement
    ***
  • Initial issue price (yield)
    (***%)
  • Geographic breakdown
    ***
  • Investor breakdown
    ***
Participants
  • Bookrunner
    ***

Conversion and exchange

  • Conversion terms
    ***

Latest issues

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Similar issues

News

03/08/2026 New issue: TSMC issued bonds (TW000B618ED2) with the coupon rate of 2.03% in the amount of TWD 14000 mln maturing in 2031
17/07/2026 TSMC Outlook Boosted by AI Growth, Analyst Raises Target
16/07/2026 Taiwan Semiconductor Manufacturing Company (NYSE: TSM): Strong AI-Driven Earnings Amidst Valuation Scrutiny
16/07/2026 Taiwan Semiconductor Manufacturing Company (NYSE:TSM) Earnings Preview: A Crucial Test for the AI Sector
06/07/2026 TSMC: A Critical Player in the AI Semiconductor Market (NYSE: TSM)
All organization news

IFRS/US GAAP reports

2025
IV q eng
2024
IV q eng
2023
IV q eng
2022
IV q eng
2021
IV q eng
2020
IV q eng
2019
IV q eng
2018
IV q eng
2017
IV q eng
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Identifiers

  • State registration number
    B618D1
  • ISIN
    TW000B618D13
  • Cbonds ID
    1281929
  • CUSIP
    ***
  • CUSIP 144A
    ***
  • CFI
    DBFUFR
  • FIGI
    BBG017DV0X61
  • Ticker
    TAISEM 1.5 05/20/27 11-3
  • Type of security by CBR
    ***

Ratings

Bond classification

  • Senior Unsecured
  • Registered
  • Coupon bonds
  • Green bonds
  • Non-complex financial instruments (MiFID)
  • Amortization
  • Callable
  • CDO
  • Convertible
  • Dual currency bonds
  • Variable rate
  • For qualified investors (CIS region)
  • Foreign bonds
  • Guaranteed
  • Inflation-linked principal
  • Supranational bond issues
  • Inflation-linked coupon
  • Mortgage bonds
  • Perpetual
  • Payment-in-kind
  • Non-Marketable Securities
  • Redemption Linked
  • Restructuring
  • Retail bonds
  • Covered
  • Securitization
  • Structured product
  • Commercial Bonds
  • Subordinated
  • Sukuk
  • Trace-eligible
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Restructuring

***

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