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QUALCOMM, 4.5% 20may2052, USD (FIGI BBG0178JDY40, WKN A3K488)

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International bonds, Trace-eligible, Senior Unsecured

Issue | Borrower
Borrower
  • M
    ***  | ***
    ***
  • S&P
    ***  | ***
    ***
  • F
    ***  | ***
    ***
Status
Outstanding
Amount
1,000,000,000 USD
Placement
***
Redemption (put/call option)
*** (-)
ACI
Country of risk
USA
Current coupon
***%
Price
Yield / Duration
  • Placement amount
    1,000,000,000 USD
  • Outstanding amount
    1,000,000,000 USD
  • USD equivalent
    1,000,000,000 USD
  • Minimum Settlement Amount
    2,000 USD
  • CFI
    DBFNGR
  • FIGI
    BBG0178JDY40
  • SEDOL
    BNG8GG6
  • Ticker
    QCOM 4.5 05/20/52

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Issue information

Profile
QUALCOMM Incorporated (Qualcomm) designs, manufactures and markets digital wireless telecommunications products and services based on its code division multiple access (CDMA) technology and other technologies. The Company operates through four segments: Qualcomm CDMA Technologies (QCT); Qualcomm ...
QUALCOMM Incorporated (Qualcomm) designs, manufactures and markets digital wireless telecommunications products and services based on its code division multiple access (CDMA) technology and other technologies. The Company operates through four segments: Qualcomm CDMA Technologies (QCT); Qualcomm Technology Licensing (QTL); Qualcomm Wireless & Internet (QWI), and Qualcomm Strategic Initiatives (QSI). QCT is a developer and supplier of CDMA-based integrated circuits and system software for wireless voice and data communications, multimedia functions and global positioning system products. QTL grants licenses or otherwise provides rights to use portions of its intellectual property portfolio, which includes certain patent rights essential to and/or useful in the manufacture and sale of certain wireless products.
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Volume
  • Placement amount
    1,000,000,000 USD
  • Outstanding amount
    1,000,000,000 USD
  • Outstanding face value amount
    1,000,000,000 USD
Face value
  • Minimum Settlement Amount
    2,000 USD
  • Outstanding face value
    *** USD
  • Increment
    *** USD
  • Face value
    1,000 USD
Listing
  • Listing

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Cash flow parameters

  • Reference rate
    ***
  • Coupon Rate
    ***
  • Day count convention
    ***
  • Interest Accrual Date
    ***
  • Coupon frequency
    *** time(s) per year
  • Payment currency
    ***
  • Maturity date
    ***

Cash flow

Calculations for international bonds are made according to the minimum trading lot
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Early redemption terms

***

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Placement

  • Placement method
    Open subscription
  • Placement type
    Public
  • Placement
    ***
  • Initial issue price (yield)
    (***%)
  • Geographic breakdown
    ***
  • Investor breakdown
    ***
Participants
  • Bookrunner
    ***, ***, ***, ***, ***, ***, ***, ***, ***
  • Depository
    ***, ***, ***

Conversion and exchange

  • Conversion terms
    ***

Covenants

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Latest issues

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Similar issues

News

02/08/2026 Qualcomm Stock: Buy or Sell?
02/08/2026 1 Incredible Reason to Buy Qualcomm Stock Right Now
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31/07/2026 QUALCOMM: Other Events, Financial Statements And Exhibits
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All organization news

IFRS/US GAAP reports

2026
I q eng
II q eng
2025
I q eng
II q eng
III q eng
IV q eng
2024
I q eng
II q eng
III q eng
IV q eng
2023
I q eng
II q eng
III q eng
IV q eng
2022
I q eng
II q eng
III q eng
IV q eng
2021
I q eng
II q eng
III q eng
IV q eng
2020
I q eng
II q eng
III q eng
IV q eng
2019
I q eng
II q eng
III q eng
IV q eng
2018
I q eng
II q eng
III q eng
IV q eng
2017
I q eng
II q eng
III q eng
IV q eng
2016
I q eng
II q eng
III q eng
IV q eng
2015
I q eng
II q eng
III q eng
IV q eng
2014
IV q eng
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Identifiers

  • ISIN
    ***
  • Cbonds ID
    1274223
  • CUSIP
    ***
  • CUSIP 144A
    ***
  • CFI
    DBFNGR
  • FIGI
    BBG0178JDY40
  • WKN
    A3K488
  • SEDOL
    BNG8GG6
  • Ticker
    QCOM 4.5 05/20/52
  • Type of security by CBR
    ***

Ratings

Bond classification

  • Senior Unsecured
  • Registered
  • Coupon bonds
  • Trace-eligible
  • Amortization
  • Callable
  • CDO
  • Convertible
  • Dual currency bonds
  • Variable rate
  • For qualified investors (CIS region)
  • Foreign bonds
  • Green bonds
  • Guaranteed
  • Inflation-linked principal
  • Supranational bond issues
  • Inflation-linked coupon
  • Mortgage bonds
  • Non-complex financial instruments (MiFID)
  • Perpetual
  • Payment-in-kind
  • Non-Marketable Securities
  • Redemption Linked
  • Restructuring
  • Retail bonds
  • Covered
  • Securitization
  • Structured product
  • Commercial Bonds
  • Subordinated
  • Sukuk
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Restructuring

***

Holders

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