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Texas Instruments, 1.9% 15sep2031, USD (FIGI BBG012F5M9N7, WKN A3KV3E)

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International bonds, Trace-eligible, Senior Unsecured

Issue | Borrower
Borrower
  • M
    ***  | ***
    ***
  • S&P
    ***  | ***
    ***
  • F
    ***  | ***
    ***
Status
Outstanding
Amount
500,000,000 USD
Placement
***
Redemption (put/call option)
*** (-)
ACI
Country of risk
USA
Current coupon
***%
Price
Yield / Duration
  • Placement amount
    500,000,000 USD
  • Outstanding amount
    500,000,000 USD
  • USD equivalent
    500,000,000 USD
  • Minimum Settlement Amount
    2,000 USD
  • CFI
    DBFUGR
  • FIGI
    BBG012F5M9N7
  • Ticker
    TXN 1.9 09/15/31

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Prospectus

Trading chart

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Issue information

Profile
Texas Instruments Inc. (TI) designs and makes semiconductors, which it sells to electronics designers and manufacturers globally. As of December 31, 2011, the Company had design, manufacturing or sales operations in more than 35 countries. The ...
Texas Instruments Inc. (TI) designs and makes semiconductors, which it sells to electronics designers and manufacturers globally. As of December 31, 2011, the Company had design, manufacturing or sales operations in more than 35 countries. The Company operates in four segments: Analog, Embedded Processing, Wireless and Other. The Company sells custom and catalog semiconductor products. Custom products are designed for a specific customer for a specific application, are sold only to that customer and are sold to the customer. The life cycles of custom products are determined by end-equipment upgrade cycles and can be as short as 12 to 24 months. Catalog products are sold through both distribution and direct channels. On September 23, 2011, the Company completed the acquisition of National Semiconductor Corporation (National).
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Volume
  • Placement amount
    500,000,000 USD
  • Outstanding amount
    500,000,000 USD
  • Outstanding face value amount
    500,000,000 USD
Face value
  • Minimum Settlement Amount
    2,000 USD
  • Outstanding face value
    *** USD
  • Increment
    *** USD
  • Face value
    1,000 USD

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Representative of the company 7 days FREE trial

Professional access to the data

Private investor

Individual access

Cash flow parameters

  • Reference rate
    ***
  • Coupon Rate
    ***
  • Day count convention
    ***
  • Interest Accrual Date
    ***
  • Coupon frequency
    *** time(s) per year
  • Payment currency
    ***
  • Maturity date
    ***

Cash flow

Calculations for international bonds are made according to the minimum trading lot
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Early redemption terms

***

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1 000 000

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100 000

stocks

175 910

ETF & Funds

100 000

indices

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full data on over 1 000 000 bonds, 100 000 stocks, 100 000 indices, 17 000 ETF and 150 000 Mutual Funds; powerful bond screener; over 350 pricing sources among stock exchanges & OTC market; ratings & financial reports; user-friendly interface; available anywhere via Website, Excel Add-in and Mobile app.

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Why

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Placement

  • Placement method
    Open subscription
  • Placement type
    Public
  • Placement
    ***
  • Initial issue price (yield)
    (***%)
  • Geographic breakdown
    ***
  • Investor breakdown
    ***
Participants
  • Bookrunner
    ***, ***, ***, ***, ***, ***, ***
  • Depository
    ***, ***, ***
  • Arranger Legal Adviser (International law)
    ***

Conversion and exchange

  • Conversion terms
    ***

Covenants

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Latest issues

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News

09/07/2026 Zacks.com featured highlights include Microchip Technology, Semtech, Texas Instruments, Amtech and Vishay Intertechnology
01/07/2026 The Zacks Analyst Blog Highlights Micron Technology, FormFactor, Texas Instruments and Taiwan Semiconductor Manufacturing
24/06/2026 Texas Instruments (NASDAQ:TXN) Outlook: AI-Driven Growth and Analyst Price Target Hike
19/06/2026 2 Pick-and-Shovel AI Stocks Powering the Data Center Boom
17/06/2026 TXN's Manufacturing Expansion Continues: Can It Strengthen Margins?
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IFRS/US GAAP reports

2026
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2025
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2024
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2023
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2022
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III q eng
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2021
I q eng
II q eng
III q eng
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2020
I q eng
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III q eng
IV q eng
2019
I q eng
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2018
I q eng
II q eng
III q eng
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2017
I q eng
II q eng
III q eng
IV q eng
2016
I q eng
II q eng
III q eng
IV q eng
2015
I q eng
II q eng
III q eng
IV q eng
2014
IV q eng
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Identifiers

  • ISIN
    ***
  • Cbonds ID
    1133879
  • CUSIP
    ***
  • CUSIP 144A
    ***
  • CFI
    DBFUGR
  • FIGI
    BBG012F5M9N7
  • WKN
    A3KV3E
  • Ticker
    TXN 1.9 09/15/31
  • Type of security by CBR
    ***

Ratings

Bond classification

  • Senior Unsecured
  • Registered
  • Coupon bonds
  • Trace-eligible
  • Amortization
  • Callable
  • CDO
  • Convertible
  • Dual currency bonds
  • Variable rate
  • For qualified investors (CIS region)
  • Foreign bonds
  • Green bonds
  • Guaranteed
  • Inflation-linked principal
  • Supranational bond issues
  • Inflation-linked coupon
  • Mortgage bonds
  • Non-complex financial instruments (MiFID)
  • Perpetual
  • Payment-in-kind
  • Non-Marketable Securities
  • Redemption Linked
  • Restructuring
  • Retail bonds
  • Covered
  • Securitization
  • Structured product
  • Commercial Bonds
  • Subordinated
  • Sukuk
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Restructuring

***

Holders

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