The Hongkong Land Company, 3.75% 27nov2028, HKD (FIGI RegS BBG00MMF70P8, XS1915535196)

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International bonds, Guaranteed, Senior Unsecured

Issue | Borrower

Borrower

M

*** | ***

***
S&P

*** | ***

***
F

*** | ***

***

Status

Outstanding

Amount

355,000,000 HKD

Placement

***

Redemption (put/call option)

*** (-)

ACI

Country of risk

Hong Kong

Current coupon

***%

Price

Yield / Duration

Reports of guarantors / borrowers / offerers

Guarantor The Hongkong Land Company

Placement amount

355,000,000 HKD
Outstanding amount

355,000,000 HKD
USD equivalent

45,279,197.27 USD
Minimum Settlement Amount

1,000,000 HKD
ISIN RegS

XS1915535196
Common Code RegS

191553519
CFI RegS

DTFNFB
FIGI RegS

BBG00MMF70P8
Ticker

HKLSP 3.75 11/27/28 EMTN

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Issue information

Borrower

Go to the issuer page
The Hongkong Land Company
Full borrower / issuer name

The Hongkong Land Company
Sector

Corporate
Industry

Real Estate Investment and Services
SPV / Issuer

Hongkong Land Notes

Volume

Placement amount

355,000,000 HKD
Outstanding amount

355,000,000 HKD
Outstanding face value amount

355,000,000 HKD
USD equivalent

45,279,197 USD

Face value

Minimum Settlement Amount

1,000,000 HKD
Outstanding face value

*** HKD
Increment

*** HKD
Face value

1,000,000 HKD

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Try in 7-days Demo access

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Track bond prices from 400+ sources

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Representative of the company 7 days FREE trial

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Individual access

Cash flow parameters

Reference rate

***

Coupon Rate

***

Day count convention

***

Interest Accrual Date

***

Coupon frequency

*** time(s) per year
Payment currency

***
Maturity date

***

Cash flow

Calculations for international bonds are made according to the minimum trading lot

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Early redemption terms

***

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1 000 000

bonds

100 000

stocks

175 910

ETF & Funds

100 000

indices

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Watchlist
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— We have everything you need:

Why

You will have detailed descriptive & pricing data for 1M bonds, 100K stocks, 100K indices, 17K ETF and 150K Mutual Funds

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Placement

Placement method

Open subscription
Placement type

Public
Placement

***
Initial issue price (yield)

(***%)
Geographic breakdown

***
Investor breakdown

***
Use of proceeds

General Corporate Purposes
Intercompany Loan
Use of proceeds description

General Corporate Purposes, Intercompany Loan

Participants

Bookrunner

***
Depository

***, ***

Conversion and exchange

Conversion terms

***

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Identifiers

ISIN RegS

XS1915535196
Cbonds ID

1106903
CUSIP RegS

***
CUSIP 144A

***
Common Code RegS

191553519
CFI RegS

DTFNFB
FIGI RegS

BBG00MMF70P8
Ticker

HKLSP 3.75 11/27/28 EMTN
Type of security by CBR

***

Ratings

Bond classification

Senior Unsecured
Coupon bonds
Bearer
Guaranteed
Non-complex financial instruments (MiFID)
Amortization
Callable
CDO
Convertible
Dual currency bonds
Variable rate
For qualified investors (CIS region)
Foreign bonds
Green bonds
Inflation-linked principal
Supranational bond issues
Inflation-linked coupon
Mortgage bonds
Perpetual
Payment-in-kind
Non-Marketable Securities
Redemption Linked
Restructuring
Retail bonds
Covered
Securitization
Structured product
Commercial Bonds
Subordinated
Sukuk
Trace-eligible

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Restructuring

***