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Hong Kong Mortgage Corporation Bonds, 1.815% 11jun2031, USD (M1011) (FIGI BBG011BD8VX2, HK0000744315)

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Domestic bonds, Senior Unsecured

Issue | Issuer
Issuer
  • M
    ***   | ***
    ***
  • S&P
    ***   | ***
    ***
  • F
    ***   | ***
    ***
Status
Outstanding
Amount
13,000,000 USD
Placement
***
Redemption (put/call option)
*** (-)
ACI
Country of risk
Hong Kong
Current coupon
***%
Price
Yield / Duration
  • Placement amount
    13,000,000 USD
  • Outstanding amount
    13,000,000 USD
  • USD equivalent
    13,000,000 USD
  • Face value
    200,000 USD
  • ISIN
    HK0000744315
  • Common Code
    235258862
  • CFI
    DTFUFB
  • FIGI
    BBG011BD8VX2
  • Ticker
    HKMTGC 1.815 06/11/31 EMTN
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Issue information

Profile
The Hong Kong Mortgage Corp Ltd provides mortgage financing services. The Company securitizes the mortgages into mortgage-backed securities and offers them for sale to investors. Hong Kong Mortgage operates in Hong Kong.
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  • Issuer
    Go to the issuer page
    Hong Kong Mortgage Corporation
  • Full borrower / issuer name
    Hong Kong Mortgage Corporation
  • Sector
    Corporate
  • Industry
    Government Agencies
Volume
  • Placement amount
    13,000,000 USD
  • Outstanding amount
    13,000,000 USD
  • Outstanding face value amount
    13,000,000 USD
Face value
  • Face value
    200,000 USD
  • Outstanding face value
    *** USD
  • Increment
    *** USD

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Cash flow parameters

  • Reference rate
    ***
  • Coupon Rate
    ***
  • Day count convention
    ***
  • Interest Accrual Date
    ***
  • Coupon frequency
    *** time(s) per year
  • Payment currency
    ***
  • Maturity date
    ***

Cash flow

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Early redemption terms

***

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100 000

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full data on over 1 000 000 bonds, 100 000 stocks, 100 000 indices, 17 000 ETF and 150 000 Mutual Funds; powerful bond screener; over 350 pricing sources among stock exchanges & OTC market; ratings & financial reports; user-friendly interface; available anywhere via Website, Excel Add-in and Mobile app.

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Why

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Placement

  • Placement method
    Open subscription
  • Placement type
    Public
  • Placement
    ***
  • Geographic breakdown
    ***
  • Investor breakdown
    ***
Participants
  • Bookrunner
    ***

Conversion and exchange

  • Conversion terms
    ***

Latest issues

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Similar issues

News

24/11/2025 New issue: Hong Kong Mortgage Corporation issued bonds (HK0001221388) with the coupon rate of 2.937% in the amount of HKD 10000 mln maturing in 2027
20/11/2025 New issue: Hong Kong Mortgage Corporation issued international bonds (XS3231178701) with the coupon rate of 3.875% in the amount of USD 1000 mln maturing in 2030
13/10/2024 New issue: Hong Kong Mortgage Corporation issued international bonds (XS2913980657) with the coupon rate of 4.125% in the amount of USD 850 mln maturing in 2027
09/10/2024 Upcoming Issue: Hong Kong Mortgage Corporation 5Y
09/10/2024 Upcoming Issue: Hong Kong Mortgage Corporation 2Y
All organization news

IFRS/US GAAP reports

2025
IV q eng
2024
II q eng
IV q eng
2023
II q eng
IV q eng
2022
II q eng
IV q eng
2021
II q eng
IV q eng
2020
II q eng
IV q eng
2019
II q eng
IV q eng
2018
II q eng
IV q eng
2017
IV q eng
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Identifiers

  • ISIN
    HK0000744315
  • Cbonds ID
    1075265
  • CUSIP
    ***
  • CUSIP 144A
    ***
  • Common Code
    235258862
  • CFI
    DTFUFB
  • FIGI
    BBG011BD8VX2
  • Ticker
    HKMTGC 1.815 06/11/31 EMTN
  • Type of security by CBR
    ***

Ratings

Bond classification

  • Senior Unsecured
  • Coupon bonds
  • Bearer
  • Non-complex financial instruments (MiFID)
  • Amortization
  • Callable
  • CDO
  • Convertible
  • Dual currency bonds
  • Variable rate
  • For qualified investors (CIS region)
  • Foreign bonds
  • Green bonds
  • Guaranteed
  • Inflation-linked principal
  • Supranational bond issues
  • Inflation-linked coupon
  • Mortgage bonds
  • Perpetual
  • Payment-in-kind
  • Non-Marketable Securities
  • Redemption Linked
  • Restructuring
  • Retail bonds
  • Covered
  • Securitization
  • Structured product
  • Commercial Bonds
  • Subordinated
  • Sukuk
  • Trace-eligible
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Restructuring

***

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