Bond Screener
Hengyang High-tech Investment (Group) Bonds, 6.5% 21jan2028, CNY (FIGI BBG00YWLT2B5, 2180010, CND100042LW0)
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Domestic bonds, Variable rate
Status
Outstanding
Amount
280,000,000 CNY
Placement
Redemption (put/call option)
ACI
CNY
No data
Country of risk
China
Current coupon
-
Price
Yield / Duration
The Hengyang High-tech Investment (Group) bond CND100042LW0 is a CNY-denominated Undefined debt security with a maturity date of 21/01/2028. The bond currently holds the status outstanding and reflects a country of risk of China. On this page you can track quotes from 1 source (such as exchange or market participant), including bid and ask quotes if any, and follow changes in the bond's price and yield over time. Key parameters of the issue include a face value of 100 CNY, a placement amount of 700,000,000 CNY and an outstanding amount of 700,000,000 CNY, which together indicate how much of the debt remains in circulation. The issue carries embedded put options detailed in the redemption schedule. In essence, this means that the holder may sell it back to the issuer on set dates. For reference and reconciliation, the bond is identified by ISIN - CND100042LW0, FIGI - BBG00YWLT2B5, CFI - DBFXFR, Ticker - HYHTIG V3.5 01/21/28 INBK.
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