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New bond issue: Cheung Kong Infrastructure Holdings issued international bonds (XS1733226747) with a 1% coupon for EUR 500.0m maturing in 2024

December 06, 2017 | Cbonds

December 05, 2017 Cheung Kong Infrastructure Holdings issued international bonds (XS1733226747) with a 1% for EUR 500.0m maturing in 2024. Bonds were sold at a price of 99.624% with an initial yield of 1.06%. Bookrunner: Deutsche Bank, HSBC, UBS. Depository: Euroclear Bank, Clearstream Banking S.A.

Issue: Cheung Kong Infrastructure Holdings, 1% 12dec2024, EUR

StatusCountry of riskRedemption (offer)VolumeIssue Rating (M/S&P/F)
outstandingHong Kong12/12/2024500,000,000 EURA/-/-

Company: Cheung Kong Infrastructure Holdings

Full company nameCheung Kong Infrastructure Holdings Limited
Country of riskHong Kong
Country of registrationBermuda
IndustryPower

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