New bond issue: Softbank Group issued international bonds with a 5.125% coupon for USD 2,000.0m maturing in 2027

September 13, 2017 - Cbonds

 

September 12, 2017 Softbank Group issued international bonds with a 5.125% for USD 2,000.0m maturing in 2027. Bonds were sold at a price of 100% with an initial yield of 5.1907%. Bookrunner: Bank of America Merrill Lynch, Barclays, BNP Paribas, Citigroup, Credit Agricole CIB, Deutsche Bank, Goldman Sachs, JP Morgan, UBS
Depository: Clearstream Banking S.A., DTCC.
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Issuer, issue numberSoftbank Group, 5.125% 19sep2027, USD
Type of debt instrumentInternational bonds
Issue statusoutstanding
Type of placementPublic
Par, currency of issueUSD 200,000
Amount2,000,000,000
ISINXS1684384867
End of placement09/12/2017
Initial issue price100
Yield at pricing5.1907
Coupon5.125%
Coupon frequency2 time(s) per year
Settlement date09/19/2017
Maturity date09/19/2027
Issue ManagersBookrunner: Bank of America Merrill Lynch, Barclays, BNP Paribas, Citigroup, Credit Agricole CIB, Deutsche Bank, Goldman Sachs, JP Morgan, UBS Depository: Clearstream Banking S.A., DTCC
Trading floorSGX
Issuer: Softbank Group
Outstanding issues:
7 issuesUSD12,335,000,000
6 issuesEUR5,125,000,000
6 issuesJPY1,560,000,000,000
Issuer rating:
Moody's Investors ServiceBa1/StableLT- foreign currency09/06/2016
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150 000
issues: local and international bonds
170
countries
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150 000
issues: local and international bonds
170
countries
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