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Domestic bonds: Applied Materials, 4.3% 15jun2021, USD
US038222AF21

  • Placement amount
    750,000,000 USD
  • Outstanding amount
    750,000,000 USD
  • Denomination
    2,000 USD
  • ISIN
    US038222AF21
  • CFI
    DBFUGR
  • FIGI
    BBG001QM8X36
  • SEDOL
    B41DRY8
  • Ticker
    AMAT 4.3 06/15/21

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Issue information

Profile
Applied Materials, Inc. (Applied) provides manufacturing equipment, services and software to the global semiconductor, flat panel display, solar photovoltaic (PV) and related industries. Applied’s customers include manufacturers of semiconductor wafers and chips, flat panel liquid crystal ...
Applied Materials, Inc. (Applied) provides manufacturing equipment, services and software to the global semiconductor, flat panel display, solar photovoltaic (PV) and related industries. Applied’s customers include manufacturers of semiconductor wafers and chips, flat panel liquid crystal displays (LCDs), solar PV cells and modules, and other electronic devices. These customers may use what they manufacture in their own end products or sell the items to other companies for use in advanced electronic components. Applied operates in four segments: Silicon Systems Group, Applied Global Services, Display, and Energy and Environmental Solutions.
Volume
  • Placement amount
    750,000,000 USD
  • Outstanding amount
    750,000,000 USD
Nominal
  • Nominal
    2,000 USD
  • Outstanding face value
    *** USD
  • Integral multiple
    *** USD

Cash flow parameters

  • Reference rate
    ***
  • Coupon Rate
    ***
  • Day count fraction
    ***
  • Interest Accrual Date
    ***
  • Coupon frequency
    *** time(s) per year
  • Payment currency
    ***
  • Delay days
    *** days
  • Maturity date
    ***
  • Early redemption date
    ***

Early redemption terms

***

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Ratings from the top 3 global ratings agencies, plus over 70 local ones

Over 300 pricing sources from the OTC market and world stock exchanges

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Placement

  • Placement method
    Open subscription
  • Placement type
    Public
  • Placement format
    Book building
  • Order book
    *** (***) - *** (***)
  • Coupon (Yield) Guidance
    ***% - ***% (*** - ***%)
  • Placement
    *** - ***
  • Initial issue price (yield)
    (***%)
  • Bids
    *** USD
  • Number of bids
    ***
  • Geographic breakdown
    ***
  • Investor breakdown
    ***
  • Listing
    ***
Participants
  • Bookrunner
    ***, ***, ***, ***
  • Depository
    ***, ***, ***

Conversion and exchange

  • Convertion date
    ***
  • Initial premium
    ***%
  • Convertible until
    ***
  • Lock-up
    *** days
  • Conversion terms
    ***

Additional information

***

Latest issues

Identifiers

  • Registration
    ***
  • Date of program registration
    ***
  • ISIN
    ***
  • CUSIP
    ***
  • CUSIP 144A
    ***
  • CFI
    DBFUGR
  • FIGI
    BBG001QM8X36
  • WKN
    A1GSDT
  • SEDOL
    B41DRY8
  • Ticker
    AMAT 4.3 06/15/21
  • Type of security by CBR
    ***

Ratings

Bond classification

  • Senior Unsecured
  • Registered
  • Coupon bonds
  • Amortization
  • Callable
  • CDO
  • Convertible
  • Dual currency bonds
  • Variable rate
  • For qualified investors (CIS region)
  • Foreign bonds
  • Green bonds
  • Guaranteed
  • Inflation-linked principal
  • Supranational bond issues
  • Inflation-linked coupon
  • Mortgage bonds
  • Perpetual
  • Payment-in-kind
  • Non-Marketable Securities
  • Redemption Linked
  • Restructuring
  • Retail bonds
  • Covered
  • Securitization
  • Structured product
  • Subordinated
  • Sukuk
  • Trace-eligible

Restructuring

***

***