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Applied Materials Bonds, 4.3% 15jun2021, USD (US038222AF21)

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Domestic bonds, Senior Unsecured

Status
Early redeemed
Amount
750,000,000 USD
Placement
***
Early redemption
*** (-)
ACI on
Country of risk
USA
Current coupon
-
Price
-
Yield / Duration
-
Calculate in two clicks! yield, duration and other parameters
Calculate in two clicks! yield, duration and other parameters
Calculator What is a calculator?
  • Placement amount
    750,000,000 USD
  • Face value
    2,000 USD
  • ISIN
    US038222AF21
  • CFI
    DBFUGR
  • FIGI
    BBG001QM8X36
  • SEDOL
    B41DRY8
  • Ticker
    AMAT 4.3 06/15/21

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900 000

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80 000

stocks

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Bond is not traded; the issue is redeemed
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Issue information

Profile
Applied Materials, Inc. (Applied) provides manufacturing equipment, services and software to the global semiconductor, flat panel display, solar photovoltaic (PV) and related industries. Applied’s customers include manufacturers of semiconductor wafers and chips, flat panel liquid crystal ...
Applied Materials, Inc. (Applied) provides manufacturing equipment, services and software to the global semiconductor, flat panel display, solar photovoltaic (PV) and related industries. Applied’s customers include manufacturers of semiconductor wafers and chips, flat panel liquid crystal displays (LCDs), solar PV cells and modules, and other electronic devices. These customers may use what they manufacture in their own end products or sell the items to other companies for use in advanced electronic components. Applied operates in four segments: Silicon Systems Group, Applied Global Services, Display, and Energy and Environmental Solutions.
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Volume
  • Placement amount
    750,000,000 USD
Face value
  • Face value
    2,000 USD
  • Outstanding face value
    *** USD
  • Increment
    *** USD
Listing
  • Listing
    ***

Cash flow parameters

  • Reference rate
    ***
  • Coupon Rate
    ***
  • Day count convention
    ***
  • Interest Accrual Date
    ***
  • Coupon frequency
    *** time(s) per year
  • Payment currency
    ***
  • Maturity date
    ***
  • Early redemption date
    ***

Cash flow

Export to Excel

Early redemption terms

***

explore the most comprehensive database

900 000

bonds globally

Over 400

pricing sources

80 000

stocks

116 000

ETF & Funds

track your portfolio in the most efficient way

  • Bond Search
  • Watchlist
  • Excel ADD-IN
Get access
×

— Are you looking for the complete & verified bond data?

— We have everything you need:

full data on over 900 000 bonds, 80 000 stocks, 116 000 ETF & Funds; powerful bond screener; over 350 pricing sources among stock exchanges & OTC market; ratings & financial reports; user-friendly interface; available anywhere via Website, Excel Add-in and Mobile app.

Register
×

Why

You will have detailed descriptive & pricing data for 650K bonds, 76K stocks, 8K ETFs
Get full access to the platform from any device & via Cbonds app
Enhance your portfolio management with Cbonds Excel Add-in
Build yield maps, make chart comparison within a click
Don't wait any longer — start using Cbonds today! Register

Placement

  • Placement method
    Open subscription
  • Placement type
    Public
  • Placement format
    Book building
  • Placement
    ***
  • Initial issue price (yield)
    (***%)
  • Geographic breakdown
    ***
  • Investor breakdown
    ***
Participants
  • Bookrunner
    ***, ***, ***, ***
  • Depository
    ***, ***, ***

Conversion and exchange

  • Conversion terms
    ***

Latest issues

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Similar issues

News

15/04/2025 Applied Materials Acquires 9% Stake in BE Semiconductor: A Strategic Bet on Hybrid Bonding Technology
14/04/2025 Applied Materials: Other Events, Financial Statements And Exhibits
06/03/2025 Applied Materials: Submission Of Matters To A Vote Of Security Holders
25/02/2025 Applied Materials, Inc. (NASDAQ:AMAT) Faces Challenges Amid Semiconductor Industry Dynamics
24/02/2025 Applied Materials: Entry Into A Material Definitive Agreement, Termination Of A Material Definitive Agreement, Creation Of A Direct Financial Obligation Or An Obligation Under An, Financial Statements And Exhibits
All organization news

IFRS/US GAAP reports

2025
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2024
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2021
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2020
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2019
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2016
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2015
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Identifiers

  • ISIN
    ***
  • Cbonds ID
    53019
  • CUSIP
    ***
  • CUSIP 144A
    ***
  • CFI
    DBFUGR
  • FIGI
    BBG001QM8X36
  • WKN
    A1GSDT
  • SEDOL
    B41DRY8
  • Ticker
    AMAT 4.3 06/15/21
  • Type of security by CBR
    ***

Ratings

Bond classification

  • Senior Unsecured
  • Registered
  • Coupon bonds
  • Amortization
  • Callable
  • CDO
  • Convertible
  • Dual currency bonds
  • Variable rate
  • For qualified investors (CIS region)
  • Foreign bonds
  • Green bonds
  • Guaranteed
  • Inflation-linked principal
  • Supranational bond issues
  • Inflation-linked coupon
  • Mortgage bonds
  • Non-complex financial instruments (MiFID)
  • Perpetual
  • Payment-in-kind
  • Non-Marketable Securities
  • Redemption Linked
  • Restructuring
  • Retail bonds
  • Covered
  • Securitization
  • Structured product
  • Commercial Bonds
  • Subordinated
  • Sukuk
  • Trace-eligible
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Restructuring

***

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