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Hengdian Group Holdings Bonds, 2.87% 4jun2021, CNY (FIGI BBG00YG69CY1, 012004239, CND100041MQ2)

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Domestic bonds, Interest at Maturity

Issue | Issuer
Issuer
  • Dagong Global
    ***   | ***
    ***
Status
Matured
Amount
1,000,000,000 CNY
Placement
***
Redemption (put/call option)
*** (-)
ACI
Country of risk
China
Current coupon
-
Price
Yield / Duration
  • Placement amount
    1,000,000,000 CNY
  • Outstanding amount
    1,000,000,000 CNY
  • Face value
    100 CNY
  • ISIN
    CND100041MQ2
  • CFI
    DBFXFR
  • FIGI
    BBG00YG69CY1
  • Ticker
    HEDIAG 2.87 06/04/21 SCP

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Issue information

Profile
Hengdian Group Holdings Limited, together with its subsidiaries, manufactures magnetic materials and electronic components such as ferrite pre-sintered powders, permanent ferrite, soft ferrite, and rare earth magnets.
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  • Issuer
    Go to the issuer page
    Hengdian Group Holdings
  • Full borrower / issuer name
    Hengdian Group Holdings
  • Sector
    Corporate
  • Industry
    Other Sectors
Volume
  • Placement amount
    1,000,000,000 CNY
  • Outstanding amount
    1,000,000,000 CNY
Face value
  • Face value
    100 CNY
  • Outstanding face value
    *** CNY
  • Increment
    *** CNY

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Cash flow parameters

  • Reference rate
    ***
  • Coupon Rate
    ***
  • Day count convention
    ***
  • Interest Accrual Date
    ***
  • Payment currency
    ***
  • Maturity date
    ***

Cash flow

Export to Excel

Early redemption terms

***

Explore the most comprehensive database

1 000 000

bonds

100 000

stocks

175 910

ETF & Funds

100 000

indices

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  • Bond Search
  • Watchlist
  • Excel ADD-IN
Get access
×

— Are you looking for the complete & verified bond data?

— We have everything you need:

full data on over 1 000 000 bonds, 100 000 stocks, 100 000 indices, 17 000 ETF and 150 000 Mutual Funds; powerful bond screener; over 350 pricing sources among stock exchanges & OTC market; ratings & financial reports; user-friendly interface; available anywhere via Website, Excel Add-in and Mobile app.

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Why

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Placement

  • Placement method
    Open subscription
  • Placement type
    Public
  • Order book
    *** - ***
  • Placement
    *** - ***
  • Initial issue price (yield)
    (***%)
  • Geographic breakdown
    ***
  • Investor breakdown
    ***

Conversion and exchange

  • Conversion terms
    ***

Latest issues

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Similar issues

News

15/05/2025 Upcoming Issue: Hengdian Group Holdings
15/05/2025 Upcoming Issue: Hengdian Group Holdings
15/05/2025 Upcoming Issue: Hengdian Group Holdings
All organization news

Identifiers

  • State registration number
    012004239
  • ISIN
    CND100041MQ2
  • Cbonds ID
    873555
  • CFI
    DBFXFR
  • FIGI
    BBG00YG69CY1
  • Ticker
    HEDIAG 2.87 06/04/21 SCP
  • Type of security by CBR
    ***

Ratings

Bond classification

  • Rank: Undefined
  • Registered
  • Interest at Maturity
  • Non-complex financial instruments (MiFID)
  • Non-Marketable Securities
  • Amortization
  • Callable
  • CDO
  • Convertible
  • Dual currency bonds
  • Variable rate
  • For qualified investors (CIS region)
  • Foreign bonds
  • Green bonds
  • Guaranteed
  • Inflation-linked principal
  • Supranational bond issues
  • Inflation-linked coupon
  • Mortgage bonds
  • Perpetual
  • Payment-in-kind
  • Redemption Linked
  • Restructuring
  • Retail bonds
  • Covered
  • Securitization
  • Structured product
  • Commercial Bonds
  • Subordinated
  • Sukuk
  • Trace-eligible
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Restructuring

***

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