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Hyosung Advanced Materials, FRN 28may2024, USD (FIGI RegS BBG0115J4594, XS2344319780)

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International bonds, Guaranteed, Variable rate, Senior Unsecured

Status
Matured
Amount
30,000,000 USD
Placement
***
Redemption (put/call option)
*** (-)
ACI
Country of risk
Republic of Korea
Current coupon
-
Price
Yield / Duration
Reports of guarantors / borrowers / offerers
Guarantor Woori Bank
Reporting IFRS
  • Placement amount
    30,000,000 USD
  • Outstanding amount
    30,000,000 USD
  • Minimum Settlement Amount
    1,000,000 USD
  • ISIN RegS
    XS2344319780
  • Common Code RegS
    234431978
  • CFI RegS
    DBVNBB
  • FIGI RegS
    BBG0115J4594
  • Ticker
    HYOSAM F 05/28/24 .

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Bond is not traded; the issue is redeemed
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Data display in a chart | table
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Issue information

Profile
Hyosung Advanced Materials Corporation operates as an advanced materials production company. The Company manufactures and sells high-strength industrial yarns, fabric, steel wire materials, and other products. Hyosung Advanced Materials markets its products worldwide.
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Volume
  • Placement amount
    30,000,000 USD
  • Outstanding amount
    30,000,000 USD
Face value
  • Minimum Settlement Amount
    1,000,000 USD
  • Outstanding face value
    *** USD
  • Increment
    *** USD
  • Face value
    1,000,000 USD

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Private investor

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Cash flow parameters

  • Variable rate type
    Floating rate
  • Reference rate
    3M LIBOR USD
  • Coupon Rate
    ***
  • Day count convention
    ***
  • Interest Accrual Date
    ***
  • Coupon frequency
    *** time(s) per year
  • Payment currency
    ***
  • Maturity date
    ***

Cash flow

Calculations for international bonds are made according to the minimum trading lot
Export to Excel

Early redemption terms

***

Explore the most comprehensive database

1 000 000

bonds

100 000

stocks

175 910

ETF & Funds

100 000

indices

Track your portfolio in the most efficient way

  • Bond Search
  • Watchlist
  • Excel ADD-IN
Get access
×

— Are you looking for the complete & verified bond data?

— We have everything you need:

full data on over 1 000 000 bonds, 100 000 stocks, 100 000 indices, 17 000 ETF and 150 000 Mutual Funds; powerful bond screener; over 350 pricing sources among stock exchanges & OTC market; ratings & financial reports; user-friendly interface; available anywhere via Website, Excel Add-in and Mobile app.

Register
×

Why

You will have detailed descriptive & pricing data for 1M bonds, 100K stocks, 100K indices, 17K ETF and 150K Mutual Funds
Get full access to the platform from any device & via Cbonds app
Enhance your portfolio management with Cbonds Excel Add-in
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Placement

  • Placement method
    Open subscription
  • Placement type
    Public
  • Placement
    ***
  • Initial issue price (yield)
  • Geographic breakdown
    ***
  • Investor breakdown
    ***
Participants
  • Bookrunner
    ***
  • Depository
    ***, ***

Conversion and exchange

  • Conversion terms
    ***

Latest issues

Show all

Similar issues

News

26/06/2025 Upcoming Issue: Hyosung Advanced Materials 1Y
26/06/2025 Upcoming Issue: Hyosung Advanced Materials (CNY 1.5 mln)
All organization news

Identifiers

  • ISIN RegS
    XS2344319780
  • Cbonds ID
    1037935
  • CUSIP RegS
    ***
  • CUSIP 144A
    ***
  • Common Code RegS
    234431978
  • CFI RegS
    DBVNBB
  • FIGI RegS
    BBG0115J4594
  • Ticker
    HYOSAM F 05/28/24 .
  • Type of security by CBR
    ***

Ratings

Bond classification

  • Senior Unsecured
  • Coupon bonds
  • Bearer
  • Variable rate
  • Guaranteed
  • Non-complex financial instruments (MiFID)
  • Amortization
  • Callable
  • CDO
  • Convertible
  • Dual currency bonds
  • For qualified investors (CIS region)
  • Foreign bonds
  • Green bonds
  • Inflation-linked principal
  • Supranational bond issues
  • Inflation-linked coupon
  • Mortgage bonds
  • Perpetual
  • Payment-in-kind
  • Non-Marketable Securities
  • Redemption Linked
  • Restructuring
  • Retail bonds
  • Covered
  • Securitization
  • Structured product
  • Commercial Bonds
  • Subordinated
  • Sukuk
  • Trace-eligible
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Restructuring

***

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