New bond issue: September 21, 2015 Applied Materials placed USD 600.0m in bonds with a 2.625% coupon
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Statusearly redeemed
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Country of riskUSA
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Redemption (put/call option)
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Amount600,000,000 USD
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М/S&P/F
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Full nameApplied Materials Inc
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Registration countryUSA
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IndustrySemiconductors
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М/S&P/F
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