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New bond issue: TSMC issued international bonds (USG91139AG31) with a 1.75% coupon for USD 900.0m maturing in 2028

April 21, 2021 Cbonds
April 20, 2021 TSMC issued international bonds (USG91139AG31) with a 1.75% for USD 900.0m maturing in 2028. Bonds were sold at a price of 99.751%. Depository: Clearstream Banking S.A., DTCC, Euroclear Bank
Bookrunner: Citigroup, Goldman Sachs, JP Morgan, Morgan Stanley.
  • Status
    outstanding
  • Country of risk
    Taiwan
  • Redemption (put/call option)
    *** (***)
  • Amount
    900,000,000 USD
  • М/S&P/F
    — / — / —
Company — TSMC
  • Full name
    Taiwan Semiconductor Manufacturing Company, Limited
  • Registration country
    Taiwan
  • Industry
    Information and High Technologies