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New bond issue: Singapore Airlines issued international bonds (XS2284332769) with a 3% coupon for USD 500.0m maturing in 2026

January 18, 2021
January 13, 2021 Singapore Airlines issued international bonds (XS2284332769) with a 3% for USD 500.0m maturing in 2026. Depository: Clearstream Banking S.A., Euroclear Bank
Bookrunner: Bank of America Merrill Lynch, Citigroup, HSBC.
Issue — Singapore Airlines, 3% 20jul2026, USD
  • Status
    outstanding
  • Country of risk
    Singapore
  • Redemption (put/call option)
    *** (***)
  • Amount
    500,000,000 USD
  • М/S&P/F
    — / — / —
Company — Singapore Airlines
  • Full name
    Singapore Airlines
  • Registration country
    Singapore
  • Industry
    Transportation

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