New bond issue: Semiconductor Manufacturing International Corporation issued international bonds (XS2101828452) with a 2.693% coupon for USD 600.0m maturing in 2025
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Statusredeemed
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Country of riskChina
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Redemption (put/call option)
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Amount600,000,000 USD
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М/S&P/F
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Full nameSemiconductor Manufacturing International Corporation
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Registration countryCayman Islands
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IndustrySemiconductors
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М/S&P/F
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