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New bond issue: Korea Development Bank issued international bonds (US500630CU09) with a 3.375% coupon for USD 500.0m maturing in 2023

March 06, 2018 | Cbonds

March 05, 2018 Korea Development Bank issued international bonds (US500630CU09) with a 3.375% for USD 500.0m maturing in 2023. Bonds were sold at a price of 99.49% with an initial yield of 3.51%. Bookrunner: Bank of America Merrill Lynch, HSBC, Korea Development Bank, Mitsubishi UFJ Financial Group, Nomura International, UBS. Depository: DTCC.

Issue: Korea Development Bank, 3.375% 12mar2023, USD

StatusCountry of riskRedemption (offer)VolumeIssue Rating (M/S&P/F)
outstandingKorea03/12/2023500,000,000 USDAA/Aa2/AA-

Company: Korea Development Bank

Full company nameKorea Development Bank
Country of riskKorea
Country of registrationKorea
IndustryBanks

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