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New bond issue: Lai Fung Holdings Limited issued international bonds (XS1747539465) with a 5.65% coupon for USD 350.0m maturing in 2023

January 11, 2018 | Cbonds

January 10, 2018 Lai Fung Holdings Limited issued international bonds (XS1747539465) with a 5.65% for USD 350.0m maturing in 2023. Bonds were sold at a price of 100% with an initial yield of 5.65%. Bookrunner: DBS Bank, HSBC, OCBC, UBS. Depository: Euroclear Bank, Clearstream Banking S.A.

Issue: Lai Fung Holdings, 5.65% 18jan2023, USD

StatusCountry of riskRedemption (offer)VolumeIssue Rating (M/S&P/F)
outstandingHong Kong01/18/2023350,000,000 USD-/-/BB-

Company: Lai Fung Holdings

Full company nameLai Fung Holdings Limited
Country of riskHong Kong
Country of registrationCayman Islands
IndustryConstruction and development


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