New bond issue: Delek Logistics issued international bonds for USD 250.0m maturing in 2025 with a 6.75% coupon.

May 19, 2017 - Cbonds

 

Delek Logistics issued international bonds for USD 250.0m maturing in 2025 with a 6.75% coupon. Bonds were sold at a price of 99.245%. Bookrunner: Bank of America Merrill Lynch, Banco Bilbao (BBVA), Fifth Third Bancorp, RBC Capital Markets
Depository: Euroclear Bank, Clearstream Banking S.A..
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Issuer, issue numberDelek Logistics Partners, 6.75% 15may2025, USD
Type of debt instrumentInternational bonds
Issue statusoutstanding
Type of placementPublic
Par, currency of issueUSD 2,000
Amount250,000,000
ISINUSU24570AA84
End of placement05/18/2017
Initial issue price99.245
Coupon6.75%
Coupon frequency2 time(s) per year
Settlement date05/23/2017
Maturity date05/15/2025
Issue ManagersBookrunner: Bank of America Merrill Lynch, Banco Bilbao (BBVA), Fifth Third Bancorp, RBC Capital Markets Depository: Euroclear Bank, Clearstream Banking S.A.
Issuer: Delek Logistics Partners
Issuer profile:
Delek Logistics Partners LP, headquartered in Brentwood, Tennessee, is a growth-oriented publicly traded master limited partnership (MLP) formed by Delek US Holdings in 2012 to own, operate, acquire,... more
Outstanding issues:
1 issuesUSD250,000,000
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