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New bond issue: Road King Infrastructure sells CNY 1300m in 2014 bonds with 6.000% coupon

February 21, 2011 | Cbonds

Road King Infrastructure (Hong Kong) on February 18, 2011 placed CNY 1300m in bonds with a 6.000% coupon, maturing in 2014. The bond was priced at 100% to yield 6%. DBS, JP Morgan (bookrunners), BBVA, Citic Bank (senior co-lead managers) arranged the deal.

Issue: Road King Infrastructure, 6% 25feb2014, CNY

StatusCountry of riskMaturity (option)AmountIssue ratings (M/S&P/F)
redeemedHong Kong02/25/20141,300,000,000 CNYWithdrawn/-/-

Company: Road King Infrastructure

Full company nameRoad King Infrastructure Limited
Country of riskHong Kong
Country of registrationHong Kong
IndustryConstruction and development

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