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New bond issue: Tower Bersama Infrastructure issued international bonds (XS2099045515) with a 4.25% coupon for USD 350.0m maturing in 2025

January 14, 2020 | Cbonds

January 13, 2020 Tower Bersama Infrastructure issued international bonds (XS2099045515) with a 4.25% for USD 350.0m maturing in 2025. Bonds were sold at a price of 100%.

Issue: Tower Bersama Infrastructure, 4.25% 21jan2025, USD

StatusCountry of riskMaturity (option)AmountIssue ratings (M/S&P/F)
outstandingIndonesia01/21/2025350,000,000 USD-/-/-

Company: Tower Bersama Infrastructure

Full company nameTower Bersama Infrastructure TBK (P.T.)
Country of riskIndonesia
Country of registrationIndonesia
IndustryCommunication

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