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International bonds: Semiconductor Manufacturing International Corporation, 0% 7nov2018, USD (Conv.) (XS0987076899)

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Convertible, Zero-coupon bonds

Status
Early redeemed
Amount
404,000,000 USD
Placement
***
Early redemption
*** (-)
ACI on
Country of risk
China
Current coupon
-
Price
-
Yield / Duration
-
Calculate in two clicks! yield, duration and other parameters
Calculate in two clicks! yield, duration and other parameters
Calculator What is a calculator?
  • Placement amount
    404,000,000 USD
  • Outstanding amount
    404,000,000 USD
  • Minimum Settlement Amount
    200,000 USD
  • ISIN
    XS0987076899
  • Common Code
    098707689
  • CFI
    DMXXXR
  • FIGI
    BBG005H711W5
  • Ticker
    SMIZCH 0 11/07/18

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Files

Release and placement notices

Prospectus

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Bond is not traded; the issue is redeemed
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Stock exchange and OTC quotes

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Issue information

Profile
Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 981) is one of the leading semiconductor foundries in the world and the largest and most advanced foundry in mainland China, providing integrated circuit (IC) foundry and technology ...
Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 981) is one of the leading semiconductor foundries in the world and the largest and most advanced foundry in mainland China, providing integrated circuit (IC) foundry and technology services at 0.35-micron to 40-nanometer. Headquartered in Shanghai, China, SMIC has a 300mm wafer fabrication facility (fab) and a 200mm mega-fab in Shanghai, a 300mm mega-fab in Beijing, a 200mm fab in Tianjin, and a 200mm fab project under development in Shenzhen. SMIC also has customer service and marketing offices in the U.S., Europe, Japan, and Taiwan, and a representative office in Hong Kong.
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Volume
  • Placement amount
    404,000,000 USD
  • Outstanding amount
    404,000,000 USD
Face value
  • Minimum Settlement Amount
    200,000 USD
  • Outstanding face value
    *** USD
  • Increment
    *** USD
  • Face value
    1,000 USD
Listing
  • Listing
    ***

Cash flow parameters

  • Reference rate
    ***
  • Coupon Rate
    ***
  • Day count convention
    ***
  • Interest Accrual Date
    ***
  • Payment currency
    ***
  • Maturity date
    ***
  • Early redemption date
    ***

Cash flow

Calculations for international bonds are made according to the minimum trading lot
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Early redemption terms

***

Auctions and additional placements

explore the most comprehensive database

800 000

bonds globally

Over 400

pricing sources

80 000

stocks

9 000

ETF

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Placement

  • Placement method
    Open subscription
  • Placement type
    Public
  • Placement
    *** - ***
  • Initial issue amount
    *** USD
  • Initial issue price (yield)
  • Geographic breakdown
    ***
  • Investor breakdown
    ***
Participants
  • Bookrunner
    ***, ***
  • Legal adviser to the arrangers
    ***, ***
  • Legal adviser to the issuer
    ***, ***

Conversion and exchange

  • Convertible until
    ***
  • Conversion terms
    ***

Additional information

Latest issues

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News

22/03/2024 Beijing’s Push to Dump Foreign Tech on Display at China Chip Fair
13/12/2023 US Still Backing China Firm Providing Chips for Drones, PLA Units
10/11/2023 China’s Top Chipmaker Sees Third-Quarter Profit Plunge 70%
10/11/2023 S&P: Semiconductor Manufacturing International Corp. 'BBB-' Ratings Withdrawn At Company's Request (Rating action commentary)
09/11/2023 S&P Global Ratings withdrew Local Currency LT credit rating for Semiconductor Manufacturing International Corporation
All organization news

IFRS/US GAAP reports

2023
I q eng
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2022
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2021
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2020
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2019
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III q eng
IV q eng
2018
I q eng
II q eng
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2017
II q eng
IV q eng
2016
I q eng
II q eng
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Identifiers

  • ISIN
    XS0987076899
  • CUSIP
    ***
  • CUSIP 144A
    ***
  • Common Code
    098707689
  • CFI
    DMXXXR
  • FIGI
    BBG005H711W5
  • WKN
    A1HSTG
  • Ticker
    SMIZCH 0 11/07/18
  • Type of security by CBR
    ***

Bond classification

  • Zero-coupon bonds
  • Rank: Undefined
  • Registered
  • Convertible
  • Amortization
  • Callable
  • CDO
  • Dual currency bonds
  • Variable rate
  • For qualified investors (CIS region)
  • Foreign bonds
  • Green bonds
  • Guaranteed
  • Inflation-linked principal
  • Supranational bond issues
  • Inflation-linked coupon
  • Mortgage bonds
  • Perpetual
  • Payment-in-kind
  • Non-Marketable Securities
  • Redemption Linked
  • Restructuring
  • Retail bonds
  • Covered
  • Securitization
  • Structured product
  • Commercial Bonds
  • Subordinated
  • Sukuk
  • Trace-eligible
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Restructuring

***

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