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International bonds: Hangzhou Hikvision Digital Technology, 1.25% 18feb2019, EUR (XS1341358247)

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Status
Matured
Amount
400,000,000 EUR
Placement
***
Redemption (put/call option)
*** (-)
ACI on
Country of risk
China
Current coupon
-
Price
-
Yield / Duration
-
Calculate in two clicks! yield, duration and other parameters
Calculate in two clicks! yield, duration and other parameters
Calculator What is a calculator?
  • Placement amount
    400,000,000 EUR
  • Outstanding amount
    400,000,000 EUR
  • Minimum Settlement Amount
    100,000 EUR
  • ISIN
    XS1341358247
  • Common Code
    134135824
  • CFI
    DYXXXR
  • FIGI
    BBG00BW014D5
  • Ticker
    HIKVIS 1.25 02/18/19

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Issue information

Profile
Hangzhou Hikvision Digital Technology Co., Ltd develops, manufactures and sells video surveillance products. The Company manufactures video and audio compression card, network hard disk video recorders, video servers, cameras, network storage, and other digital products.
Volume
  • Placement amount
    400,000,000 EUR
  • Outstanding amount
    400,000,000 EUR
Face value
  • Minimum Settlement Amount
    100,000 EUR
  • Outstanding face value
    *** EUR
  • Increment
    *** EUR
  • Face value
    1,000 EUR
Listing
  • Listing
    ***

Cash flow parameters

  • Reference rate
    ***
  • Coupon Rate
    ***
  • Day count convention
    ***
  • Interest Accrual Date
    ***
  • Coupon frequency
    *** time(s) per year
  • Payment currency
    ***
  • Maturity date
    ***

Cash flow

Calculations for international bonds are made according to the minimum trading lot

Early redemption terms

***

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800 000

bonds globally

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80 000

stocks

9 000

ETF

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Placement

  • Placement method
    Open subscription
  • Placement type
    Public
  • Placement
    ***
  • Initial issue price (yield)
    (***%)
  • Geographic breakdown
    ***
  • Investor breakdown
    ***
  • The purpose of placing
    The Issuer estimates that the net proceeds from this offering, after deducting the discounts and commissions to be charged by the Joint Lead Managers and other estimated expenses payable in connection with this offering, will be approximately C = 397.12 million. The Issuer intends to use the net proceeds from this offering for the construction of Tonglu Production Base and Internet Industrial Base, the procurement of fixed assets and other general corporate purposes.
Participants
  • Bookrunner
    ***, ***, ***, ***, ***, ***, ***, ***, ***, ***, ***, ***, ***, ***
  • Arranger Legal Adviser (Domestic law)
    ***
  • Issuer Legal Adviser (Domestic law)
    ***
  • Issuer Legal Adviser (International law)
    ***, ***

Conversion and exchange

  • Conversion terms
    ***

Covenants

  • Change of Control

    ***

  • Collective Action Clause

    ***

  • Covenant Suspension/Fall-Away

    ***

  • Cross Default

    ***

  • Designation of Restricted and Unrestricted Subsidiaries

    ***

  • Events of Default

    ***

  • Financial Covenants

    ***

  • Limitation on Business Activities

    ***

  • Limitation on Dividend and Other Payment Restrictions Affecting Restricted Subsidiaries

    ***

  • Limitation on Indebtedness

    ***

  • Limitation on Investments

    ***

  • Limitation on Liens

    ***

  • Limitation on Restricted Payments

    ***

  • Limitation on Sale of Assets

    ***

  • Limitation on Sale/Leaseback

    ***

  • Limitation on Subsidiary Debt

    ***

  • Limitation on layering (anti-layering)

    ***

  • Limitations on transactions with affiliates

    ***

  • Merger Restrictions

    ***

  • Rating Trigger

    ***

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Additional information

Latest issues

Identifiers

  • ISIN
    XS1341358247
  • CUSIP
    ***
  • CUSIP 144A
    ***
  • Common Code
    134135824
  • CFI
    DYXXXR
  • FIGI
    BBG00BW014D5
  • WKN
    A18XUN
  • Ticker
    HIKVIS 1.25 02/18/19
  • Type of security by CBR
    ***

Bond classification

  • Rank: Undefined
  • Registered
  • Coupon bonds
  • Amortization
  • Callable
  • CDO
  • Convertible
  • Dual currency bonds
  • Variable rate
  • For qualified investors (CIS region)
  • Foreign bonds
  • Green bonds
  • Guaranteed
  • Inflation-linked principal
  • Supranational bond issues
  • Inflation-linked coupon
  • Mortgage bonds
  • Perpetual
  • Payment-in-kind
  • Non-Marketable Securities
  • Redemption Linked
  • Restructuring
  • Retail bonds
  • Covered
  • Securitization
  • Structured product
  • Commercial Bonds
  • Subordinated
  • Sukuk
  • Trace-eligible

Restructuring

***

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