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International bonds: STATS ChipPAC, 5.375% 31mar2016, USD (USY8162BAF23)

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Status
Matured
Amount
200,000,000 USD
Placement
***
Redemption (put/call option)
*** (-)
ACI on
Country of risk
Singapore
Current coupon
-
Price
-
Yield / Duration
-
Calculate in two clicks! yield, duration and other parameters
Calculate in two clicks! yield, duration and other parameters
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  • Placement amount
    200,000,000 USD
  • Outstanding amount
    200,000,000 USD
  • Minimum Settlement Amount
    100,000 USD
  • ISIN RegS
    USY8162BAF23
  • Common Code RegS
    057652721
  • CFI RegS
    DBFUGR
  • FIGI RegS
    BBG001CZ3NZ4
  • SEDOL
    B67SLF0
  • Ticker
    STATSP 5.375 03/31/16 REGS

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Issue information

Profile
STATS ChipPAC Ltd. is a leading service provider of semiconductor packaging design, bump, probe, assembly, test and distribution solutions. We have the scale to provide a comprehensive range of semiconductor packaging and test solutions to a ...
STATS ChipPAC Ltd. is a leading service provider of semiconductor packaging design, bump, probe, assembly, test and distribution solutions. We have the scale to provide a comprehensive range of semiconductor packaging and test solutions to a diversified global customer base servicing the computing, communications and consumer markets. Our services include: •Packaging services: providing leaded, laminate, memory card and wafer level chip-scale packages (CSP) to customers with a broad range of packaging solutions and full backend turnkey services for a wide variety of electronics applications. We also provide redistribution layers (RDL), integrated passive devices (IPD) and wafer bumping services for flip chip and wafer level CSPs. As part of customer support on packaging services, we also offer package design; electrical, mechanical and thermal simulation; measurement and design of leadframes and laminate substrates. •Test services: including wafer probe and final testing on a diverse selection of test platforms covering the major test platforms in the industry. We have expertise in testing a broad variety of semiconductors, especially mixed-signal, radio frequency (RF), analog and high-performance digital devices. We also offer test-related services such as burn-in process support, reliability testing, thermal and electrical characterization, dry pack and tape and reel. •Pre-production and post-production services: such as package development, test software and related hardware development, warehousing and drop shipment services. We have a leadership position in providing advanced packages, such as flip chip, stacked die (SD), System-in-Package (SiP), as well as BGA packages and wafer level CSPs. We are also a leader in testing mixed-signal semiconductors or semiconductors combining the use of analog and digital circuits in a chip. Mixed-signal semiconductors are used extensively in fast-growing communications and consumer applications. We have strong expertise in testing a wide range of high-performance digital devices.
  • Borrower
    Go to the issuer page
    STATS ChipPAC
  • Full borrower / issuer name
    STATS ChipPAC
  • Sector
    Corporate
  • Industry
    Semiconductors
Volume
  • Placement amount
    200,000,000 USD
  • Outstanding amount
    200,000,000 USD
Face value
  • Minimum Settlement Amount
    100,000 USD
  • Outstanding face value
    *** USD
  • Increment
    *** USD
  • Face value
    1,000 USD

Cash flow parameters

  • Reference rate
    ***
  • Coupon Rate
    ***
  • Day count convention
    ***
  • Interest Accrual Date
    ***
  • Coupon frequency
    *** time(s) per year
  • Payment currency
    ***
  • Maturity date
    ***

Cash flow

Calculations for international bonds are made according to the minimum trading lot

Early redemption terms

***

explore the most comprehensive database

800 000

bonds globally

Over 400

pricing sources

80 000

stocks

9 000

ETF

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Why

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Placement

  • Placement method
    Open subscription
  • Coupon (Yield) Guidance
    ***% - ***%
  • Placement
    ***
  • Initial issue price (yield)
    (***%)
  • Bids
    *** USD
  • Number of bids
    ***
  • Geographic breakdown
    ***
  • Investor breakdown
    ***
Participants
  • Bookrunner
    ***

Conversion and exchange

  • Conversion terms
    ***

Additional information

Latest issues

Identifiers

  • ISIN RegS
    ***
  • ISIN 144A
    ***
  • CUSIP RegS
    ***
  • CUSIP 144A
    ***
  • Common Code RegS
    057652721
  • Common Code 144A
    057652888
  • CFI RegS
    DBFUGR
  • CFI 144A
    DBFUGR
  • FIGI RegS
    BBG001CZ3NZ4
  • FIGI 144A
    BBG001CYBPV7
  • SEDOL
    B67SLF0
  • Ticker
    STATSP 5.375 03/31/16 REGS
  • Type of security by CBR
    ***

Bond classification

  • Rank: Undefined
  • Registered
  • Coupon bonds
  • Amortization
  • Callable
  • CDO
  • Convertible
  • Dual currency bonds
  • Variable rate
  • For qualified investors (CIS region)
  • Foreign bonds
  • Green bonds
  • Guaranteed
  • Inflation-linked principal
  • Supranational bond issues
  • Inflation-linked coupon
  • Mortgage bonds
  • Perpetual
  • Payment-in-kind
  • Non-Marketable Securities
  • Redemption Linked
  • Restructuring
  • Retail bonds
  • Covered
  • Securitization
  • Structured product
  • Commercial Bonds
  • Subordinated
  • Sukuk
  • Trace-eligible

Restructuring

***

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